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Gigabyte B760M Gaming X AX (Wi-Fi)
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Original price was: ₹17,990.₹16,990Current price is: ₹16,990.
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Description
GIGABYTE B760M GAMING X AX DDR5 Motherboard
- Supports Intel® Core™ 14th/ 13th /12th processors
- Unparalleled Performance：Hybrid 8+1+1 Phases Digital VRM Solution
- Dual Channel DDR5：4*DIMMs XMP Memory Module Support
- Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors
- Advanced Thermal Design & M.2 Thermal Guard ：To Ensure VRM Power Stability & M.2 SSD Performance
- EZ-Latch：PCIe 4.0×16 Slot with Quick Release Design
- Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax
- Extended Connectivity：Front USB-C® 10Gb/s, DP, HDMI
- Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card
UNPARALLELED PERFORMANCE
With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming.
OUTSTANDING THERMAL DESIGN
GIGABYTE Motherboards’ Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.
M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Benefit of Wi-Fi 6E
- Dedicated spectrum in 6GHz band for less interference
- 5.5X throughput than 802.11ac 1×1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience
Connecting the Future – Front USB3.2 Gen 2 Type-C®
USB 3.2 Gen 2 provides USB 3.2 Gen 2 ports with speeds up to 10Gbps. With twice the bandwidth compared to its previous generation as well as backwards compatibility with USB 2.0 and USB 3.2 Gen1, the much improved USB 3.2 Gen 2 protocol is available over the new reversible USB Type-C™ and the traditional USB Type-A connector for better compatibility over a wider range of devices.
Specifications
| Model Number | B760M-GAMING-X-AX |
| CPU | LGA1700 socket: Support for the 14th, 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors L3 cache varies with CPU (Please refer “CPU Support List” for more information.) |
| Chipset | Intel® B760 Express Chipset |
| Memory | Support for DDR5 7600(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules 4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1R x 8 / 2R x 8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1R x 8 / 2R x 8 / 1R x 16 memory modules Support for Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” for more information.) |
| Onboard Graphics | Integrated Graphics Processor-Intel® HD Graphics support: 1 x DisplayPort, supporting a maximum resolution of 4096 x 2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3 1 x HDMI port, supporting a maximum resolution of 4096 x 2160@60 Hz * Support for HDMI 2.0 version and HDCP 2.3. (Graphics specifications may vary depending on CPU support.) |
| Audio | Realtek® Audio CODEC High Definition Audio 2 / 4 / 5.1 / 7.1-channel Support for S/PDIF Out * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. |
| LAN | Realtek® 2.5GbE LAN chip (2.5 Gbps/ 1 Gbps/ 100 Mbps) |
| Wireless Communication Module | Intel® Wi-Fi 6E AX210 (PCB rev. 1.0) WIFI a, b, g, n, ac, ax, supporting 2.4 / 5 / 6 GHz carrier frequency bands BLUETOOTH 5.3 Support for 11ax 160 MHz wireless standard and up to 2.4 Gbps data rate Intel® Wi-Fi 6E AX211 (PCB rev. 1.1) WIFI a, b, g, n, ac, ax, supporting 2.4 / 5 / 6 GHz carrier frequency bands BLUETOOTH 5.3 Support for 11ax 160 MHz wireless standard and up to 2.4 Gbps data rate Realtek® Wi-Fi 6E RTL8852CE (PCB rev. 1.2) WIFI a, b, g, n, ac, ax, supporting 2.4 / 5 / 6 GHz carrier frequency bands BLUETOOTH 5.3 Support for 11ax 160 MHz wireless standard and up to 2.4 Gbps data rate (Actual data rate may vary depending on environment and equipment.) |
| Expansion Slots | CPU: 1 x PCI Express x 16 slot, supporting PCIe 4.0 and running at x 16 (PCIE X 16) * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIE X 16 slot. Chipset: 1 x PCI Express x 16 slot, supporting PCIe 3.0 and running at x 4 (PCIE X 4) |
| Storage Interface | CPU: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x 4 / x 2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 22110 / 2280 PCIe 4.0 x 4 / x 2 SSD support) (M2P_SB) 4 x SATA 6 Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices |
| USB | Chipset: 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header) 1 x USB 2.0 / 1.1 port on the back panel Chipset+2 USB 2.0 Hubs: 8 x USB 2.0 / 1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers) |
| Internal I/O Connectors | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12 V power connector 1 x CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 2 x M.2 Socket 3 connectors 4 x SATA 6 Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x S/PDIF Out header 1 x USB Type-C® header, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0 / 1.1 headers 2 x Thunderbolt™ add-in card connectors 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x serial port header 1 x Q-Flash Plus button 1 x reset jumper 1 x Clear CMOS jumper |
| Back Panel Connectors | 3 x USB 3.2 Gen 1 ports 5 x USB 2.0 / 1.1 ports 2 x SMA antenna connectors (2T2R) 1 x HDMI 2.0 port 1 x DisplayPort 1 x RJ-45 port 3 x audio jacks |
| I/O Controller | iTE® I/O Controller Chip |
| H/W Monitoring | Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Fan fail warning Fan speed control * Whether the fan speed control function is supported will depend on the fan you install. |
| BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
| Unique Features | Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus |
| Bundled Software | Norton® Internet Security (OEM version) LAN bandwidth management software |
| Operating System | Support for Windows 11 64-bit Support for Windows 10 64-bit |
| Form Factor | Micro ATX Form Factor; 24.4 cm x 24.4 cm |
